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Principal Semiconductor Packaging Engineer
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Oxford
On-site
GBP 80,000 - 100,000
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Job summary
An innovative firm is seeking a Principal Packaging Engineer to lead the packaging roadmap for cutting-edge quantum processor devices. This role involves developing advanced semiconductor and photonic packaging methods, ensuring optimal thermal performance, and collaborating with both internal teams and external suppliers. The ideal candidate will have a strong educational background and a proven track record in packaging engineering. Join a forward-thinking team and contribute to groundbreaking technology in a dynamic environment where your expertise will make a significant impact.
Qualifications
- Experience in semiconductor and photonic packaging methods.
- Strong communication skills and experience with 3rd party suppliers.
Responsibilities
- Steering the packaging roadmap for quantum processor devices.
- Designing and supervising failure analysis experiments.
Skills
semiconductor packaging methods
photonic packaging methods
die bonding methods
communication skills
Education
Degree in Engineering or related field
Job description
Job Description
Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices. The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
- Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
- Knowledge of die bonding methods for good thermal and mechanical performance
- Experience working with 3rd party suppliers
- Strong internal and external communication skills
- Degree qualified
Please contact Rachel Anderson for further details.
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