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Principal Semiconductor Packaging Engineer
IC Resources
Oxford
On-site
GBP 50,000 - 90,000
Full time
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Job summary
An established industry player is seeking a Principal Semiconductor Packaging Engineer to lead innovative packaging solutions for quantum processors. This role involves developing advanced packaging methods, including wirebond and bumping techniques, and ensuring optimal thermal performance. The ideal candidate will have extensive experience in semiconductor and photonic packaging, along with strong communication skills to collaborate with internal teams and external suppliers. Join a dynamic environment where your expertise will contribute to cutting-edge technology in semiconductor manufacturing and nanotechnology research.
Qualifications
- Experience in semiconductor and photonic packaging methods is essential.
- Strong communication skills for working with suppliers and teams.
Responsibilities
- Steer the packaging roadmap for quantum processor devices.
- Develop wirebond and bumping methods for effective packaging.
Skills
Job description
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices. The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
- Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
- Knowledge of die bonding methods for good thermal and mechanical performance
- Experience working with 3rd party suppliers
- Strong internal and external communication skills
Mid-Senior level
Full-time
Manufacturing, Engineering, and Science
Semiconductor Manufacturing, Nanotechnology Research, and Manufacturing
Please contact Rachel Anderson for further details.
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