Power Module Process Expert (m/w/d)

Job Description

About us

About Li Auto: We're a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services.

About the team

Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field. With a strong focus on innovation and cutting-edge research, we have established ourselves as pioneers in the area of automotive grade SiC device packaging and application. We welcome candidates who are passionate about pushing the boundaries of power module packaging and are eager to contribute to our team's pioneering work. Join our team and be part of an exciting journey where you can make a significant impact in the field of power semiconductors.

Duties and Responsibilities

1. Tracking SiC power module technology trends and defining power module process technology roadmap.
2. Leading team to complete pre-research of advanced process technologies and organize technical cooperation with universities and research institutes.
3. Leading team to develop advanced power module processes and output process files.
4. Support product development team to finish product development and import to factory for mass production.
5. Support mass production process teams to solve major process issues and improve reliability and yield.

Requirements

Education/Experience:

1. Bachelor degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields.
2. More than 8 years of experience in power semiconductor packaging product development or technology research and development.
3. Experience in industry-leading product development and mass production.
4. Proficient in packaging system design, thermal design, electrical design, and reliability design, with industry-leading professional ability in one aspect.
5. Have successful experience in SiC module development, with products achieving mass production status.

Knowledge:

1. Familiar with the overall situation of the semiconductor packaging industry, and have good interpersonal relationships in the industry.
2. Profound knowledge of key packaging processes & corresponding equipment, e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.

Skills and Competencies:

1. Proactive, with a pioneering spirit and a good sense of internal and external client.
2. Passionate about engineering, with a strong spirit of innovation.
3. Good command of English written and oral communication skills.
4. Excellent team coordination and communication skills.

Contact HR: Penny Email: (Inhalt entfernt)