Packaging Expert for Integrated Photonics (m/w/x)

ZEISS Group
Oberkochen
EUR 40.000 - 60.000
Jobbeschreibung

We are looking for an experienced and talented Packaging Expert to join our integrated photonics team. As a Package Designer (m/w/d), you will play a key role in the design and development of advanced photonic packaging solutions that enable the high performance and reliability of our photonic integrated circuits (PICs). You will work with multi-disciplinary teams to create innovative packaging designs that meet the technical requirements of advanced photonic systems. This is an exciting opportunity to be part of a fast-growing technology area, where you will contribute to the commercialisation and scaling of next-generation photonic technologies.


Your role:

Package Design & Development:

  • Design and develop photonic packaging solutions for photonic integrated circuits (PICs), including mechanical, thermal, and optical interfaces.

  • Optimize package designs for performance, reliability, and manufacturability, considering thermal management, optical coupling, electrical connectivity, and mechanical stability.

  • Work with materials such as silicon photonics, III-V semiconductors, and fiber-optic components in packaging designs.

Prototyping & Fabrication:

  • Collaborate with external suppliers and internal teams to build prototypes and transition from concept to full-scale production.

  • Ensure design-for-manufacturability (DFM) principles are applied to the photonic packages to ensure scalability and cost-effectiveness.

Thermal & Mechanical Analysis:

  • Perform thermal and stress analysis of photonic packages to ensure proper heat dissipation and mechanical stability under varying environmental conditions.

  • Use simulation tools to validate the design and ensure performance under thermal cycling, vibration, and mechanical stress.

Optical Alignment & Integration:

  • Design package structures that optimize optical alignment between the PICs, optical fibers, optical components and external devices such as lasers and detectors.

  • Develop high-precision alignment and assembly techniques to minimize optical losses and enhance signal integrity.

Collaboration:

  • Work within a dedicated team of scientists and development engineers to drive the development of photonic technologies with respect to a wide range of applications.

  • Work closely with photonic designers, engineers, process engineers, and manufacturing teams to refine packaging solutions.

  • Support cross-functional teams in product development, providing input on package constraints and opportunities.

Testing and Validation:

  • Define test protocols to validate the performance and reliability of the packaging solutions.

  • Analyze data from thermal, mechanical, and optical tests to improve packaging designs and ensure product reliability.

Your Profile

  • Master’s degree or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.

  • Specialized knowledge or coursework in photonics, optoelectronics packaging, or microsystems.

  • 3+ years of industry or academic experience in the design and development of packaging solutions, preferably for photonics, optoelectronics, or semiconductor devices.

  • Experience with packaging techniques such as wire bonding, flip-chip bonding, and fiber-optic alignment is highly desirable.

  • Experience working with optical beam assemblies is a plus.

  • Experience working with high-frequency electrical packaging and RF interconnects is a plus.

  • Proficiency with CAD tools for 3D modeling and simulation (e.g., SolidWorks, AutoCAD, or ANSYS).

  • Experience with thermal and stress simulation tools such as COMSOL or FEA software.

  • Understanding of materials used in photonics packaging, including ceramics, polymers, metals, and adhesives.

  • Familiarity with cleanroom and assembly techniques for photonic and electronic components.

  • Strong analytical and problem-solving skills, with attention to detail in complex systems.

  • Excellent communication and collaboration abilities, with a proactive approach to teamwork in English and German

  • Ability to work in a fast-paced, deadline-driven environment.

Your ZEISS Recruiting Team:

Katharina Dandorfer
Erhalte deine kostenlose, vertrauliche Lebenslaufüberprüfung.
Datei wählen oder lege sie per Drag & Drop ab
Avatar
Kostenloses Online-Coaching
Erhöhe deine Chance auf eine Einladung zum Interview!
Sei unter den Ersten, die neue Stellenangebote für Packaging Expert for Integrated Photonics (m/w/x) in Oberkochen entdecken.