Thermal Mechanical Engineer

We are looking for a Thermal Mechanical Simulation Engineer who will work with a worldwide design team and provide innovative thermal mechanical solutions to complex mechanical reliability problems in SiP package product development. Evaluate, review, and sign-off performance approval of customer product designs.

RESPONSIBILITIES:

1. Conducting thermal and mechanical stress simulation and test projects by technical expertise to bring solutions to new products.
2. Participating in product design development, characterization, and volume production test strategy for high-performance, high-volume semiconductor packages.
3. Deep understanding of thermal mechanical modeling and simulation of complete systems including high-performance semiconductor chips and SiP modules.
4. Familiarity with and knowledge of JEDEC thermal and reliability specifications.
5. Participating in customer product discussions and specification lock.
6. Generating IPs for the company.

REQUIREMENTS:

1. Able to conduct thermal and mechanical stress modeling in high-performance computing and/or System-in-Package (SiP) design.
2. MS degree in thermal, mechanical engineering with +5 years of experience required; PhD degree in ME with +3 years preferred.
3. Hands-on skills with design simulation tools or equivalent FEA/CAE tools.
4. Knowledge of mechanical FEA & design tools such as ANSYS mechanical, Icepack, Flotherm, Abaqus, AutoCAD.
5. Solid fundamentals and expertise in thermal mechanical stress modeling of electronic package systems to optimize advanced packages and SiP modules.
6. Solid expertise in reliability testing and material characterization for high-performance computing and SiP, including JEDEC 51 series, live product validation, etc.

All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

We regret that only shortlisted candidates will be notified.

People Profilers Pte Ltd