Sr / Principal Engineer, Advance Packaging Process Engineering

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron's Assembly Package Technology Development team is looking for a motivated and experienced individual contributor for this position in Process Development team.

A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams.

Assessing processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).

An important topic is the path finding of innovative package technology: Deep fundamental understanding of the key risks in Photo/Etch/Bumping/WetPVD/CVD, WSS (Wafer Support System), Thermal Compression Bonding/Flip chip and HBM technologies.

Finally, the hands-on integration experience in Wafer Fabrication or Wafer Level package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.

Responsibilities

• Ensure smooth transition from new process development, 1st qualification success to small volume production launch.

• Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode (NPI) requirements and schedule.

• Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.

• Lead/collaborate with cross function team/site, to ensure successful transfer to NPI & HVM.

• Qualify new process/technology/equipment/materials.

• Implement PMI (Process Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM.

Technical Capability

• Identify path finding opportunities for continuous yield improvement and cost reduction activities.

• To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process.

• Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.

Provide New Solutions

• Define, develop and establish process capabilities, strategy and roadmap.

• To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or related field.

• Minimum of 3 years of experience in Wafer Fabrication or Wafer Level package process (Photo/Etch/Bumping/Wet/PVD/CVD, WSS (Wafer Support System), Thermal Compression Bonding/Flip chip and HBM technologies).

• Minimum of 3 years of experience in semiconductor manufacturing or related fields.

• Proven track record in yield management and driving yield improvement initiatives.

• Deep understanding of semiconductor manufacturing processes, yield analysis, and statistical process control (SPC).

• Hands-on experience with data analysis tools such as JMP, or equivalent.

• Strong communication skills, and able to present complex technical data and trends to leadership and non-technical audiences.

• Proven ability to work with multi-functional teams and influence partners to achieve strategic goals.

• Problem-Solving Skills: Strong analytical skills with the ability to troubleshoot and resolve complex technical issues in a high-pressure environment.

• Project Management: Ability to manage numerous projects simultaneously and prioritize tasks in a fast-paced environment.

• Cross-Cultural Communication: Experience working with teams across different geographies and cultures.

Performs hardware, software, semiconductor design or telecomm engineering assignments.