Semicon Plating Process Engineer

Responsibilities:

1. Write process specifications and operator instructions.
2. Sustain and provide continuous process improvement through planning, evaluating, verifying, and executing procedures to ensure that products meet all customer requirements in terms of cost, yield, and cycle time.
3. Provide interim and long-term corrective actions for any discrepancies.
4. Liaise with customers and potential customers on the development and improvement of process, material, and equipment capabilities.

Requirements:

3 years of Process Engineer experience in the fast-moving semiconductor industry is preferred.

Engineering degree from a recognized university.

Experience in Wet Etch and plating.

Knowledge of JMP, 8D, FMEA, and DOE methodologies will be advantageous.

Independent self-starter with a drive to meet operational goals.

High level of commitment and passion.

All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

We regret that only shortlisted candidates will be notified.