Research Engineer /Senior Research Engineer, (Heterogeneous Int), IME

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications.
• Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
• Lead capability development projects with manageable risks and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability and new.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.

Qualifications and Skills

Candidates should meet the following criteria:

Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.

Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications.

Technical Expertise: Hands-on experience in flip chip bonding is preferable.

Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.

Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.

Excellent written and verbal communication abilities.

Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.

Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.

What We Offer

The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.

A collaborative and interdisciplinary work environment.

Access to state-of-the-art facilities and resources.

Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!