R&D Process Engineer (Etch)

R&D Process Engineer (Etch)

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service manufacturing equipment for the semiconductor and display industries. Our innovations are at the foundation of the technology that transforms every part of our lives. We offer an exciting place to grow and learn alongside some of the best people you’ll ever meet. Join us to Make Possible a Better Future.

The Advanced Packaging Development Center (APDC) is a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding.

We are currently seeking an experienced and passionate Process Engineer (R&D) to join APDC now. Apply now if you fit the description below!

Key Responsibilities

1. Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines.
2. Perform hardware characterization on a variety of difficult systems, within safety guidelines.
3. Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues.
4. Generate internal and external documentation for products, presentations and technical reports.
5. Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision.
6. Measure film properties and interpret data.
7. Identify, select and work with vendors and suppliers with limited supervision.
8. Implement new technology, products and analytical instrumentation.

Requirements

1. Bachelor, Master or PhD degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field.
2. More than 3 years relevant working experiences in Plasma Etch process development.
3. Work in cleanroom/lab environment.
4. Resourceful, meticulous and problem-solving attitude.

Working Location: Science Park II

Additional Information

Time Type: Full time

Employee Type: Assignee / Regular

Travel: Not specified

Relocation Eligible: No

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.