PRINCIPAL R&D/PRODUCT DVL ENGINEER 1

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products and are responsible for product development and qualification from market definition through production and release. They assist in the qualification of suppliers for new products to ensure quality parts, materials, and services for new or improved manufacturing processes. The teams conduct feasibility studies, testing on new and modified designs, and support detailed design, testing, prototype fabrication, and manufacturing ramp. They provide all required product documentation including Solid Model, 2D/3D production drawings, product specifications, and testing requirements.

Job Responsibilities

• Subject matter expert in signal integrity design, simulation and validation activities through product development cycles.
• Establishing signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers.
• Performing signal integrity simulations for multiple high-speed standards on each product.
• Driving product development for business success.
• Engaging in innovative simulation and test tool improvement and process enhancement.
• Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint.
• Being a mentor and teacher to other engineers across disciplines / BUs, writing and presenting technical papers at internal and external conferences.
• Analyzing competitive products and driving internal & competing IP positions.

Job Requirements

• Bachelor’s degree in Electrical Engineering; Master's Degree preferred.
• Minimum of 10 years of relevant work experience in electrical design, RF design or PCB design.
• A solid understanding of electromagnetic theory and electrical circuit behavior.
• Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools).
• Expert with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent).
• Expert with high-speed test equipment (VNA, TDR, BERT).
• Expert with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
• Expert with printed circuit board layout and design (Altium preferred), fabrication and assembly.
• Proficient with data analysis techniques and design geometry tolerance impacts.
• Experience with physical layer communications systems and architectures.
• Fluent in English (both verbal and written).
• Ability to work in a global environment – accommodating varying time zones and collaborating across geographies.
• Expert in analytical capabilities to interpret simulation and lab data to identify issues and provide solutions.
• Learning Capability: Open minded, coachable, willing to learn new skills, and motivated to grow.
• Pro-active in identifying complex situations, providing solutions, and driving improvements.
• Experience writing technical papers and presenting to BU-level organizations and external conferences.
• Proficient at owning project SI responsibilities and driving team actions across multi-discipline engineering & manufacturing teams.

Nice to Have Skills/Experience:

• Experience with interconnect design, including socket/connector/cable/cable assembly design.
• Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end).
• Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences.
• Strong organizational and time management skills with an ability to manage multiple tasks/deadlines/projects.
• Six Sigma methodologies or strong data analytics background.
• Printed circuit board design, fabrication and assembly (Altium, AutoCAD).
• Experience in project leadership across design, development & manufacturing teams.
• Test equipment knowledge (oscilloscope, vector network analyzer, BERT).
• Signal conditioning techniques (equalization, amplification).
• Direct customer design and support experience.
• Application and test knowledge of high-speed devices and equalization techniques.

Competencies

Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

Location: Singapore, 01, SG, 200233

Travel: 10% to 25%

Requisition ID: 121829