Lead the release and transfer of process options at external foundries.
Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process.
Lead and steer the projects towards timely completion to support NXP business needs.
Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc.
Job Qualification
Bachelor or MSc in physics or electrical engineering.
In-depth knowledge of IC devices and processes.
>10 years of experience with front-end IC process integration, working in foundries’ production or development teams.
Hands-on experience in being a lead; leading teams with responsibilities in transfer or sustaining projects during production.
All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/integration lead.
Good communication skills.
Pro-active working attitude, creative, pragmatic, enterprising and result driven.
Having the ability to influence and steer a discussion.
Familiar in managing/working with foundries, maximising leverage from foundries.