Package Development Engineering (PDE) Core Engineering Module Engineer

Responsibilities

• Excellent execution on assembly process for 1st NPI success and smooth transfer process from NPI to HVM.
• Excellent execution of the qualification of NPI products/packages build that proliferate from the pilot products and packages according to planned timeline.
• Full responsibility on supporting NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation, and documentation.
• Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline, and design rules.
• Collaboration with multi-functional team from NPI to LVM/HVM process transfer. On-time execution of NPI Customer samples and Engineering Samples build for new products and packages.

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continuous improvement action, with problem-solving methodology, statistical analysis, and integration solution decision.
• Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
• Continuously develop in-depth assembly process technical knowledge, well understand process capability/tolerance/spec limit/CpK, and apply key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
• Global leader for cross-team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology Enablement and Development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior to 1st Qual Silicon delivery.
• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues).
• Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensuring key process technology and capability enablement is in-line.
• Frequent review and participation in Competitor Analysis, to understand market trends and competitor’s technology/capability boundary.
• Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment, and safe launch.

Teamwork and General Expectation

• Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross-team (peers, counterpart).
• Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations, and decision-making.
• Develop, or coordinate development of, training materials for existing/new processes.
• Safety: Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout, and chemical safety.

Qualification

• Bachelor or Masters in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 1-3 or more years of experience in Semiconductor Manufacturing, Process & Equipment Engineering and/or New Product Introduction.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills, and proficiency in statistical analysis/method.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Organized, meticulous, and strong focus on results.
• Excellent analytical skills.
• Excellent communication and written skills.