Failure Analysis, Senior Engineer

Company:

Qualcomm Global Trading Pte. Ltd

Job Area:

Engineering Group, Engineering Group > Failure Analysis Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Failure Analysis Engineer, you will evaluate electrical and mechanical characteristics of systems and/or integrated circuits, components, and sub-components to determine the cause of failure. Qualcomm Engineers collaborate with various teams to perform failure analyses and solve unique challenges as they arise.

Job Responsibilities:

• Provide failure analysis (FA) support for customer issues using various FA tools and techniques.
• Demonstrate expertise in electrical fault isolation (EFI) techniques such as thermal emission, photon emission, OBIRCH/TIVA, and dynamic laser stimulation, along with physical failure analysis (PFA) applications including CSAM, X-ray, sample preparation, chemical etching, SEM/EDX, and FIB for both package and silicon die level analysis.
• Collaborate closely with cross-functional teams, including Product Test Engineering and RMA Engineering, to verify and validate failures, set up tests, and characterize failure modes using various automated test equipment (ATE) or bench setups.
• Establish correlations between EFI and PFA results through GDS layout and schematic analysis, and compile comprehensive FA reports.
• Participate in the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects.
• Take ownership of equipment to ensure optimal working conditions, including troubleshooting and maintenance in collaboration with vendors.

Job Requirements:

• Degree in IC Design, Electrical Engineering, Computer Engineering, Material Science, or a related field.
• Minimum of 3 years of experience in failure analysis or testing within the semiconductor industry.
• Familiarity with semiconductor fabrication, testing, assembly, and packaging processes.
• Strong communication skills and a team-oriented mindset.
• Preferred knowledge and experience in RF, Bluetooth, WLAN, Design for Test (DFT) Diagnosis, and ATE (93K/Teradyne).
• Knowledge of programming/scripting languages such as Python is an advantage.

Minimum Qualifications:

• Bachelor's degree or equivalent in Science, Engineering, or related field and 2+ years of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience.
• OR Master's degree in Science, Engineering, or related field and 1+ year of chip or wafer-level Failure Analysis (e.g., physical/electrical failure analysis) or related work experience.
• OR PhD in Science, Engineering, or related field.
• 1+ year of working experience in a physical/chemical laboratory setting.