Process ownership in the area of mechanical wafer processing – such as backgrinding, temporary/permanent bonding, sawing, and debonding.
Maintain single process performance by applying statistical process control (SPC), fault detection & classification (FDC), etc.
Support productivity goals of our in-house production.
(Re-) qualification of single processes.
Maintain related controlled documents - e.g., control plan, Failure Mode and Effects Analysis (FMEA), Workstation Procedure (WSP), and general documentation.