Senior Staff Engineer Technology Integration

Driver of Package Technology DFMEA

Job Description

In your new role you will:

• Owner of Risk Interaction assessment and mitigation work packages.
• Responsible for Integration of unit processes (BOM and Process) in package platform including defining risk assessment plans, study interaction with other processes, and defining process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.
• Driver/team member for 8D/problem solving for interaction issues.
• Assessment of impact of design rules on inter-process interaction.

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Knowledge in semiconductor packaging, assembly and test.
• Good aptitude for communication, collaboration, negotiation and solution finding.
• Familiar with Front-End/Back-End and Back-End/Back-End Interactions.
• 8D & T6s methodology.
• Knowledge in Internal Package analysis / first level reliability.

Are you in?

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.