Senior Engineer, Process Module Development Engineering

Senior Engineer, Process Module Development Engineering

At Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can create what’s next. To fulfill our vision, we are always on the lookout for potential team members who share our passion for solving problems to empower others.

SanDisk’s Penang SSD Platform Technology Development Integration (PTDI) organization is a SSD technology development group that will be embedded in SanDisk’s green-field production facility, SanDisk Storage Malaysia (SDSM) located in the new Batu Kawan Industrial Park, Penang, Malaysia. PTDI is looking for Process Module Engineer (Material/Process) to join a new team tasked with starting up a vertically integrated SSD-focused technology development team with the charter of developing new generations of SSD products for clients, enterprise, and emerging data storage solutions.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements.
• Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements.
• Develops new package and SMT process qualification programs.
• Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
• Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
• Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.
• Transfers process to high volume manufacturing and provide support in new factory start-up.
• Acts as a liaison with suppliers/vendors.
• Maintains product quality while developing and introducing package cost reduction programs.
• Coordinates the introduction of new package processes into production.
• Using appropriate tools, performs integrity analysis of packages.

Qualifications

REQUIRED:

• Bachelor/Master/PhD engineering/material/science required plus min 5 years of relevant work experience, min 2 year for PhD. Relevant work experience must be in engineering role within semiconductor industry.

PREFERRED:

• Demonstrated track record to pathfinding and development new SMT material.
• Demonstrated track record to rapidly analyze and solve complex engineering issues.
• Demonstrated track record working hands-on around technical equipment and processes.
• Proficient in statistical analysis towards problem solving.
• Demonstrated track record to summarize complex data sets for technical and non-technical audiences.
• Highly self-motivated and self-directed with demonstrated ability to work well with people.
• Proven success leading technical team(s) in previous work experience.

SKILLS:

• Track record of AI/ML experience is added advantage.
• Strong verbal and written communications skills.

Additional Information

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