Senior Engineer, Process Module Development Engineering

Job Description

SanDisk’s Penang SSD Platform Technology Development Integration (PTDI) organization is a SSD technology development group that will be embedded in SanDisk’s green-field production facility, SanDisk Storage Malaysia (SDSM) located in the new Batu Kawan Industrial Park, Penang, Malaysia. PTDI is looking for a Process Module Engineer (Material/Process) to join a new team tasked with starting up a vertically integrated SSD-focused technology development team with the charter of developing new generations of SSD products for clients, enterprise, and emerging data storage solutions. The vertically integrated manufacturing capability of SDSM represents the most fundamental shift in completing the end-to-end manufacturing value chain for SanDisk’s solid-state NAND data storage products.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

1. Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements.
2. Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity, and manufacturing requirements.
3. Develops new package and SMT process qualification programs.
4. Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
5. Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp.
6. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools.
7. Establishes process control systems.
8. Transfers process to high volume manufacturing and provides support in new factory start-up.
9. Acts as a liaison with suppliers/vendors.
10. Maintains product quality while developing and introducing package cost reduction programs.
11. Coordinates the introduction of new package processes into production.
12. Using appropriate tools, performs integrity analysis of packages.

PME Specific Role Description includes the following but not limited to:

1. SMT material and process development
2. SMT AI/ML integration development
3. SMT technology (material/process/metrology/equipment) pathfinding & roadmap
4. Stencil design/development for new components
5. DFM assessment and NUDD risk management
6. Process-Material-Component-board-drive interactions
7. DOE & Mechanical and Material Lab Tools & Failure Analysis knowledge
8. Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc.
9. Statistical Tools: Statistical analysis (JMP/Minitab), GreenBelt/BlackBelt certification
10. Special engineering characterization & improvement projects
11. Factory emergency taskforce support

Qualifications

REQUIRED:

1. Bachelor/Master/PhD engineering/material/science required plus min 5 years of relevant work experience, min 2 years for PhD.
2. Relevant work experience must be in an engineering role within the semiconductor industry.
3. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence.

PREFERRED:

1. Demonstrated track record to pathfinding and development new SMT material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory.
2. Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamentals on root causing through failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
3. Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques).
4. Proficient in statistical analysis towards problem solving and the use of Minitab or JMP and Excel.
5. Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution.
6. Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition.
7. Proven success leading technical team(s) in previous work experience.

SKILLS:

Track record of AI/ML experience is added advantage. Strong verbal and written communications skills.

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Western Digital's Ethics Helpline or email compliance@wdc.com.