RF Assembly Process Engineer
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NXP Semiconductors
Kuala Lumpur
MYR 100,000 - 150,000
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4 days ago
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Job description
Roles and Responsibilities
Responsible for Quality, Yield, Cost and Productivity improvement activities related to Wire bond process in RF Assembly.
Partner with manufacturing and equipment team to support delivery, work on daily production line issues, drive quality and operational excellence.
Responsible for process yield improvements and LOH reduction through systemic problem solving and identifying solutions to baseline issues.
Partner with supplier, vendor, procurement to work on productivity and cost improvement projects for the operation.
Support NTI/NPI qualification, apply lessons learned and ensure smooth transition to high-volume manufacturing. Collaborate with API.
Responsible for FMEA, Control Plan, OCAP and SWE as documentation owner and to drive enhancement and compliance.
Work on strategic industrialization plan, automation and quality firewall implementation.
Collaborate with cross-functional team to improve manufacturing robustness and process stability.
Support internal and external audit, drive compliance to requirements.
Profile
Bachelor’s Degree in Engineering Discipline (Material Science/Electrical/Mechanical or equivalent).
Good knowledge in material science especially metallurgy.
Technically competent, data-driven and hands-on with strong analytical thinking and good problem-solving skills.
Desire to learn, take up new challenges, consistently challenge the status quo and eager to strive for success.
Strong interpersonal skills, a good team player with the ability to work independently and resourcefully.
Able to multi-task, work under pressure and tight deadlines, and comfortable working in a fast-paced environment.
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