RF Assembly Process Engineer

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NXP Semiconductors
Kuala Lumpur
MYR 100,000 - 150,000
Be among the first applicants.
4 days ago
Job description

Roles and Responsibilities

  • Responsible for Quality, Yield, Cost and Productivity improvement activities related to Wire bond process in RF Assembly.
  • Partner with manufacturing and equipment team to support delivery, work on daily production line issues, drive quality and operational excellence.
  • Responsible for process yield improvements and LOH reduction through systemic problem solving and identifying solutions to baseline issues.
  • Partner with supplier, vendor, procurement to work on productivity and cost improvement projects for the operation.
  • Support NTI/NPI qualification, apply lessons learned and ensure smooth transition to high-volume manufacturing. Collaborate with API.
  • Responsible for FMEA, Control Plan, OCAP and SWE as documentation owner and to drive enhancement and compliance.
  • Work on strategic industrialization plan, automation and quality firewall implementation.
  • Collaborate with cross-functional team to improve manufacturing robustness and process stability.
  • Support internal and external audit, drive compliance to requirements.

Profile

  • Bachelor’s Degree in Engineering Discipline (Material Science/Electrical/Mechanical or equivalent).
  • Good knowledge in material science especially metallurgy.
  • Technically competent, data-driven and hands-on with strong analytical thinking and good problem-solving skills.
  • Desire to learn, take up new challenges, consistently challenge the status quo and eager to strive for success.
  • Strong interpersonal skills, a good team player with the ability to work independently and resourcefully.
  • Able to multi-task, work under pressure and tight deadlines, and comfortable working in a fast-paced environment.
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