Process Engineer (Wirebond AOI)

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NXP Semiconductors
Kuala Lumpur
MYR 100,000 - 150,000
Be among the first applicants.
4 days ago
Job description

Responsibilities:

  1. Lead improvement at the Wire Bond Process and manage all process control systems to maximize quality outputs.
  2. Champion the Statistical Process Control reporting for the leaded WB department.
  3. Drive WB LOH to align with ATKL Goal and meet customer on-time delivery.
  4. Drive all quality excursions at the Wire Bonding process.
  5. Drive yield improvement activities for all the leaded WB.
  6. Work closely with the NPI team on the small leadframe package.

Qualifications:

  1. Bachelor's degree in an engineering-related field and Wire bonding experience would be an added advantage.
  2. Knowledge in Statistical analysis tool experience (e.g., JMP).
  3. High ownership and accountability to ensure targets are achieved in a timely manner.
  4. Excellent interpersonal communication skills and ability to work well in a team environment to develop positive relationships.
  5. Takes initiative, is action-oriented, and constantly raises the bar to drive excellent results.
  6. Possess a quality mindset and engineering curiosity to deep dive for continuous improvement.
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