Responsible for process yield and on-time delivery performance.
Collaborate with customers and the execution of daily process performance, tooling verification, qualification, and product transfer.
Review and optimize existing assembly procedures and develop logical steps to enhance manufacturability.
Create and maintain assembly manufacturing documentation like process specifications, visual aids, manufacturing routes, and work instructions.
Provide support for continual improvement of yields and product costs through elimination, simplification, integration, and automation approaches.
To provide the necessary engineering support and coordination of pilot builds to ensure new assemblies are completed on time and with minimum resources.
Identify and quantify quality problems with materials and/or processes and provide solutions.
To liaise with SQE or suppliers on issues related to incoming material, process development, improvement, and first article verification.
Perform GR&R and correlation studies for tools and fixtures used in the assembly process.
Drive technical project tasks to completion in accordance with the project schedule.
Expert in wire bonding and die attach procedures and processes.
Performs any other duties as directed by the immediate supervisor from time to time.
Job requirements:
Bachelor/Master Degree in Electrical/Electronics Engineering.
Experience working in Assembly, SMT, PCBA, Manual Insert, Die Attach, Wire Bond and semiconductor manufacturing environments is an added advantage.
Good in the documentation for process specification and work instruction.
Good computer literacy, communication skills, and reporting of information and data.
Positive attitude and ability to obey instructions from superior.