Process Development Principal Engineer

Job Responsibilities:

• To plan, develop and implement individual/organizational development plan of PD module MBOs.
• Focus will be on Back End Of Line (BEOL) development - from SILICIDE through CONTACT, METALISATION and PASSIVATION loops.
• TECHNOLOGY TRANSFER & DEVELOPMENT: Acquire from our technology partner (internal/external) the knowledge necessary for the successful transfer or development of technology. Support/work the development of new processes and transfer project based on customers’ needs. Coordinate available resources from the process engineering, product engineering, FA and manufacturing group in troubleshooting, resolving issues, process improvement and yield enhancement.
• Enhance the yield and reliability of the acquired technology and process. DOE design for technology optimization. Qualify the acquired technology successfully in company. Transfer developed process to YE and support stabilization.
• EHS and Quality: To contribute towards the achievement of quality objectives by complying with the quality operating system and participating in continuous improvement activities (defect prevention, reduction of variation or prevention of waste). To contribute towards the achievement of the EHS objectives by complying with the EHS policy and participating in the implementation of EHS management system. Any other assignment deemed fit that shall be given to you from time to time.

Qualifications:

• Bachelor’s Degree or higher in Engineering/Science and preferably with 12 years of working experience in semiconductor device physics & process integration.

Preferred Skills:

• Excellent communication/presentation skills. Fluent in English, written and spoken.
• Good leadership and organizing abilities.
• Strong administration skills – planning/organizing/coordination & documentation.
• Customer service skills – serve internal customers. Teamwork and collaboration skills.
• Test pattern design for electrical & process monitoring.
• Job view for GDS data & MEBES data.
• TCAD simulation Semiconductor device physics and process simulation skills.
• Understanding of the procedure of the development and transfer. Knowledge of semiconductor physics, device and reliability technology.
• Knowledge of Package technology (Wire Bond, Wafer Level Package) would be advantageous. Knowledge of MEMS technology would be advantageous.
• Computer literacy in Microsoft Excel, Word, Power Point and Outlook.

Tahap senioriti

Senior Engineer, Manufacturing Engineering