Power Module Process Development Engineer (Backend)

Job Summary:

Power module assembly process development including:

1. Plasma cleaning
2. Adhesion promoter coating
3. Pressfit pin insertion
4. Glue dispensing/Case attach
5. Si Gel filling
6. Terminal welding

Technical Leadership on process technology development and responsible processes between PIDC and Manufacturing. Establishing process POR through setup, feasibility, and characterization followed by package development procedure.

1. Process Development for Si-gel filled power module:

1. Capable of understanding power module design and proposing improvements from End of Line process.
2. Familiar with DFMEA, updating DFMEA and generating PFMEA linked with DFMEA.
3. Familiar with Si glue/gel, pressfit pin, and terminal welding (Ultrasonic).
4. Capability to define KPIV from failure modes.
5. Capability to define KPOV and generate output by analyzing process capability.
6. Responsible for providing technical reports from FMEA failure modes based on statistical analysis (JMP, Minitab).
7. Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc).

2. Technical Leadership on Assembly Process:

1. Capable of initiating new processes and equipment in collaboration with technical leaders and suppliers.
2. Responsible for specification generation and buy-off.
3. Capable of creating COO for new processes and equipment.
4. Capable of benchmarking new and better processes/equipment that do not exist in the company.
5. Capability to create process technology roadmap.
6. Capability to generate new design rules based on characterization, working with technical leaders and designers.
7. Capable of understanding customer requirements, applications, and EHS.
8. Finding systematic solutions and improvement planning for process defects.
9. Supporting quality issues during production, and effectively working with the manufacturing team.

3. COE Line Equipment Maintenance and Management:

1. Responsible for tooling and jig design, working with designers and suppliers for new tooling/jig design.
2. Responsible for equipment/tooling/jig readiness on time.
3. Leading process technicians/operators to do the right job.
4. Sharing process technical issues, results, and improvement plans with technical leaders.

Requirements:

Experienced year: Min. 10 years. Experienced areas include Plasma cleaning, Adhesion promoter coating, Pressfit pin insertion, Si glue/gel filling, Case attach, and terminal welding. Design career or equipment engineering career is a plus. Experienced packages: Si gel filled power module (Intelligent Power Module, Dual Side Cooling Module, Power Discretes). Nationality: Local preferred. Education: BS or MS degree. Skills: Fluent in English communication, familiar with statistical software (JMP, Minitab), Auto-CAD, and MS-Office (ppt presentation). Personal characteristics: self-motivated, independent, open-minded, willing to take risks, and good at managing.