PCB Layout Designer (Based in Ipoh)

Job Summary

PCB Layout Designer will be responsible for the layout and routing of advanced technology printed wiring circuit board designs in both rigid and flex layout designs with signal data rates more than 10 GB/s. This will include the generation of all fabrication and assembly packages required for product development and production.

Primary Duties & Responsibilities

• Create new rigid, flex & rigid/flex multilayer printed wiring board designs.
• Edit and revise existing rigid, flex & rigid/flex multilayer printed wiring board designs.
• Supporting comprehensive design reviews and documentation.
• Incorporate changes required from supplier notices or feedback from DFM reviews along with any outstanding TQs.
• Get technical questions and follow ups out to engineering within 24 hours.
• Post processing of all output generation of release documentation for production.
• Generate water marked Gerber files for supplier DFM reviews.
• Upon job assignment, maintain daily/weekly work logs, recurring engineer meetings, end of day job posts, and project archiving.
• Follow written processes and procedures for meeting company design requirements.
• Able to work well individually or with teams supporting internal customer needs.
• Meet the agreed deadlines for projects and/or design tasks.

Education & Experience

• C.I.D.+ certification preferred.
• Experience using Microsoft Office Suite.
• Good oral and written communications skills.
• An A.A. degree in Electronic Design or equivalent formal training, preferred.
• Working experience of IPC design standards and specifications required.
• Drafting and documentation requirements for printed boards with ASME Y14.5 standards.
• 5+ years’ experience and proficient in Expedition, PADs Layout, PADs Logic, and CAM350 required. Experience with Downstream BluePrint for creating documentation a plus.

Skills & Other Requirements

• Expertise in Co-planar wave guides.
• Experience with Multi-Layer Flex circuit designs required.
• Experience with single ended impedance-controlled signal routing.
• Expertise in high-speed differential and single ended impedance-controlled signal routing.
• Expertise in HDI design, transmission lines, microstrip and strip line routing.
• Experience with chip-on-board (COB), chip-on-flex (COF), and Flip Chip Technology.
• Experience with BGA technology 0.35mm pitch and smaller.
• Understanding of stubs, reflections, crosstalk, and ground bounce (or switching noise).
• Experience with microwave interconnecting signal paths at 10 GB/s data rates & higher.
• 5+ years’ experience and proficient in Expedition, PADs Layout, PADs Logic, and CAM350 required. Experience with Downstream BluePrint for creating documentation a plus.