NPI Process Engineer

NXP Semiconductors
Kuala Lumpur
MYR 100,000 - 150,000
Job description

Job Responsibilities:

  1. Responsible for supporting New Package development of processes in automotive applications.
  2. Responsible for quality, yield, cost and process improvement activities.
  3. Responsible for process documentation, process specifications, standard work instructions, OCAP, and Lead.
  4. Collaborate closely with cross-functional team members to resolve conflicts and make fast decisions to avoid any risk to the organization, company, or customer.
  5. Take ownership to work closely with upper management to align the scope and direction of key projects.

Qualifications:

  1. Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
  2. 1-2 years of work experience with semiconductor assembly background for automotive customers.
  3. Experience in MAPBGA, SiP, FCCSP, FCBGA, etc., packing development will be an added advantage.
  4. Candidate must have great interpersonal skills, leadership skills, and be self-driven with a positive mindset eager to strive for success.
  5. Good SPC, Process Control, and other relevant statistical & problem-solving skills.
  6. Proficient in Microsoft applications (PowerPoint, Excel Macro, Word, etc.). Project management knowledge is an added advantage.
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