Assembly Staff Engineer

Talent Recruit
Ipoh
MYR 100,000 - 150,000
Job description

We are representing a world-known company with a global footprint that provides high-performance, semiconductor-based power electronic solutions. As they continue to expand, they are seeking an Assembly Staff Engineer to be based at their vendor in Ipoh, Perak.

Position Title: Assembly Staff Engineer (New Position)

Working hours: Monday to Friday (8.00am to 5.45pm)

Salary: up to RM14,000

Responsibilities:

  • Handle assembly quality issues, verify the root cause, and ensure corrective actions are implemented effectively and timely to prevent recurrence.
  • Conduct regular audits and quarterly performance ratings, discussing quality/technical issues with suppliers to support them in continuous improvement and provide reliable products.
  • Monitor and analyze assembly yield, defect modes, and SPC weekly to assure ongoing quality system capability, and daily check the assembly WIP to ensure short assembly cycle times and on-time delivery.
  • Conduct risk assessments and manage dispositions for wafer incoming issues at suppliers and on-hold lots with assembly issues at the test floor.
  • Generate and evaluate supplier quality reports, establish appropriate baselines, and determine continuous improvement opportunities.
  • Coordinate with FA engineers to identify assembly failures, address root causes, and implement corrective actions with assemblers.
  • Coordinate the qualification of new suppliers, materials, packages, and assembly processes.

Requirements:

  • Bachelor's degree, majoring in Engineering or a related discipline.
  • Familiarity with general assembly processes and QA controls (8D CAR, FMEA, SPC, etc).
  • Knowledge of basic concepts of FA and reliability.
  • Fluent in English and Mandarin (due to business needs as this position reports to the Assembly Manager in China).
  • 5-10 years of hands-on experience in assembly processes, preferably from the MNC semiconductor industry.
  • Experience with packages: QFN, LGA.
  • Experience with assembly processes: flip chip bond, wafer saw, wire bonding, molding.
  • Medical (In-Hospital Care & Ambulatory Care).
  • Term life insurance.

Qualified and interested candidates may apply online or email their updated resume to alex(at)talentrecruit.com.my.

Only shortlisted candidates will be notified.

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