Principal Engineer, Packaging Engineering

Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world’s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You’ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That’s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital, G-Technology, SanDisk and WD brands.

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Lead PCB DFM with multi-function teams for PCB design tape out.
• Act role of PCB designer including PCB DFM for staging SSD project.
• Proceed PCB placement and PCBA proposal with consideration of mechanical process & design feedback and thermal solution.
• Perform PCB design library maintenance, PCB panel and fabrication drawing template generation and Valor ERF maintenance.
• Lead PCB design rule roadmap development with multi-function teams.
• Interface seamlessly with PCB SQE, PCB vendors and HW engineer for required PCB design rule development.
• Lead project to success and on time deliverable with various manufacturing and function teams at various WDC locations for new product development and PCB design improvement.
• Deliverable of Automation program for efficiency of PCB design and DFM.

Qualifications

REQUIRED:

• More than 5 years PCB or package substrate design experience.
• Bachelor or Master in science or engineering.
• Familiar with PCB fabrication and PCBA design rule.
• Work thinking with digital twin and data analytic methodology.
• Leadership characteristics for project moving on and on time deliverable with team.

PREFERRED:

• Good to have 2.5D package or die layout design skill set and experience.
• Nice to have experience in substrate and bonding design for SiP projects like iNAND, NAND BGA, uSD, SD and USB and package design tool Cadence SIP or APD.

SKILLS

• Design software Allegro, AutoCAD and PCB DFM Valor.
• Automation programming skill in PCB DFM Valor, Cadence Allegro and SIP.
• Good communication and interpersonal skill is necessary.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at staffingsupport@wdc.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital’s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to compliance@wdc.com.