Assy Backend Process Engineer

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NXP Semiconductors
Kuala Lumpur
MYR 100,000 - 150,000
Be among the first applicants.
4 days ago
Job description

JOB SUMMARY
The job incumbent is responsible for the Backend Ball Attach Process and will focus on the troubleshooting of both quality and process problems in the relevant field by maintaining the Standard Operating Procedures (SOP) and guidelines describing essential functions or practices. Ensure successful manufacturing production runs by assessing risks (Material such as solder ball, substrate and machine stability), setting preventative measures. At the same time, focus on the New Product Introduction by creating new process flow.

KEY ACCOUNTABILITIES

  1. Lead assigned processes/module.
  2. Participate, conduct & optimize improvements related to quality, yield, productivity, delivery, and cost.
  3. Involve in commissioning new machines, monitoring modifications, upgrades, and troubleshooting existing processes.
  4. Ensure that all aspects of related processes comply with control regulations' standards.
  5. Liaise with vendors/suppliers & ensure all related items (machine, materials, etc.) comply with updated specifications.
  6. Create process control standards, process standards, Standard Work Instructions, establish engineering Operation Manuals & ensure all engineering-related documents are up to date.
  7. Liaise & support New Product Introduction (NPI) related activities from prototype to High Volume Manufacturing (HVM) stage.
  8. Comply with and support all department and corporate policies and procedures such as quality, safety, and environmental policy.
  9. Provide process-related guidelines and participate in Material Disposition Review (MDR). Plan and implement New Structure Development of existing and new products. Control customer documents and technical information. Promote 5S and safety activities.

Requirements:

  1. Bachelor/Master degree in engineering field.
  2. Problem solving and analytical ability.
  3. Understanding of engineering drawings and manufacturing processes.
  4. Understanding of JMP, FMEA, RC Analysis, SWOT Analysis, and DMAIC.
  5. A keen learner, self-motivated, and possess good teamwork spirit.
  6. Work independently with minimal supervision.
  7. Good communication skills, with the ability to present data effectively, analyze, and solve problems.
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