Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever.
As a Post Encap (Laser Mark/Solder Ball Placement/ Package Singulation/Final Visual Inspect) process engineer, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability. Your tasks will include working on process yield improvement, cost reduction, efficiency improvement, and risk management, as well as resolving manufacturing line problems.
You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D, or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment, and material evaluation/optimization to implement changes at process steps, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications, and managing, auditing, and liaising with material suppliers to achieve quality, cost, and management objectives.
Master's or Degree in Mechanical, Electrical & Electronics, or related Engineering.
Excellent interpersonal, communication, and leadership skills with an extremely positive attitude towards working as a team.
Self-motivated, possess initiative, and ability to work independently.
Team player with good communication and interpersonal skills.