Master Thesis: Online-Junction-Temperature Estimation of Double-Side-Cooled SiC Power-Module

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Master Thesis: Online-Junction-Temperature Estimation of Double-Side-Cooled SiC Power-Module, Saint Valentin

Client:

Magna

Location:

Saint Valentin, Austria

Job Category:

Other

EU work permit required:

Yes

Job Reference:

e4cf203f5837

Job Views:

4

Posted:

15.03.2025

Expiry Date:

29.04.2025

Job Description:

Group Introduction

Advancing mobility. Making automotive technology that is smarter, cleaner, and safer, while still fun to drive. And making it for everyone. That’s what we’re passionate about at Magna Powertrain. We do it by creating world-class powertrain solutions for conventional, hybrid, and pure electric vehicles. We’re making electrification more than a buzzword, we’re bringing it to the road. Innovation is what drives us and we drive innovation. Dream big and create the future of mobility at Magna Powertrain.

Due to their low thermal resistance and therefore better chip utilization, double side cooled (DSC) power-modules gained significant attention in latest applications. Especially the rapidly accelerating trend towards silicon carbide semiconductors (SiC) promotes DSC-technology as total phase current per die area can be significantly increased, where the raw semiconductor material Silicon Carbide is still expensive.

Even though DSC-power-modules offer significant advantages in terms of chip utilization, there are still major drawbacks related to testing the devices inside the power-inverter. The most prominent disadvantage is the lack of an easy to implement option to monitor junction temperature in operation, which is the main influencing factor for power-module degradation and limited lifetime.

This is related to the sandwich structure of the thermal stack, where the bare dies (power chips) are arranged between two individual DBC-substrates. The above-mentioned sandwich structure impedes any optical path with direct visibility to the dies. To overcome this issue, TSEP (Temperature-Sensitive-Electrical Parameters) methods are usually adopted, where the thermal state of the device is monitored using one or more temperature dependent electrical parameters.

Scope of this work is the selection, modeling, and practical application of a suitable TSEP method in real inverter application using a DSC-silicon carbide module. Theoretical results should be evaluated by modeling and on a hardware demonstrator which should be designed as part of this work.

Your Responsibilities

1. Literature research on available TSEP-methods
2. Modeling and simulation of different TSEP-methods
3. Selection of a suitable method for a hardware build-up
4. Design of a hardware demonstrator with focus on EMI-robustness
5. Build-up of the demonstrator
6. Measurements
7. Documentation

Your Qualifications

1. Knowledge of TSEP-methods
2. Experience in modeling and simulation
3. Ability to design hardware demonstrators
4. Skills in measurements and documentation

Further information

For writing a master thesis you will receive a monthly fee of gross € 700,--. Start: by arrangement (duration approx. 6 months)

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