Wafer Dicing Engineer (On-site)

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.

At Xanadu, we are learners, innovators, researchers, collaborators, and problem solvers. We are creating something that has never been built before. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems and literally change the world. And that is something to be excited about!

Your role and responsibilities:

As a wafer dicing engineer, you will join a growing photonic packaging team to enable and optimise dicing solutions in multiple material platforms. Dicing is a critical step in manufacturing samples suitable for building Xanadu’s fault-tolerant quantum computer. You will work with production-grade equipment in a dynamic environment to push the state-of-the-art singulation technology to scale up further in the long term.

Main responsibilities will include:

• Recipe development and optimisation of the dicing tools and associated metrology equipment
• Specifying new tools, chemicals, and techniques to meet the technical objectives of the packaging team
• Process tool ownership: tool performance monitoring, documentation, and training

Required Qualifications and experience:

• BSc or higher in mechanical engineering, materials science, or a relevant related discipline
• 4+ years of industry experience in dicing process development
• Experience in optimising wafer dicing processes for high throughput and high-quality dicing line finish
• Proficiency in creating dicing routines from the wafer map and reticle design
• Proficiency in optical microscopy techniques
• Experience with root cause failure analysis (RCFA)
• Proficiency in handling wafers, tape mounting, post-dice cleaning
• Experience with automated pick-and-place equipment
• Self-motivated, comfortable working both independently and collaboratively with people of all disciplines on complex projects in a fast-paced environment
• Comfortable in managing external partner relationships for equipment troubleshooting and process optimisation
• Strong interpersonal skills

Preferred qualifications and experience:

(Preference will be given to candidates that have at least 2 of the following)

• MSc in mechanical engineering, materials science, or a relevant related discipline
• 6+ years experience in dicing process development
• Experience in developing wafer dicing processes for 300mm wafers
• Experience in wafer wet chemical processing
• Experience in nanofabrication
• Proficiency with DOE

Values:

Our values are important. They are fundamental and lay the foundation for culture at Xanadu.

At Xanadu, we are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Human Resources at hr@xanadu.ai.