Distinguished System Architect - xPU

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Information Technology

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2

Posted:

30.03.2025

Expiry Date:

14.05.2025

Job Description:

Huawei Canada has an immediate permanent opening for a Distinguished System Architect.

About the team:

Initially founded in 1991 as Huawei's ASIC Design Center, the IC Lab is a leading global fabless semiconductor lab. This lab delivers trusted, cutting-edge semiconductor products and services for smart devices, contributing to smart home and mobility solutions. The local team in Canada specializes in semiconductors and chipset solutions.

About the job:

1. Architectural Leadership: Define next-generation xPU system architectures for AI and data center workloads, balancing performance, power, and scalability. Develop strategies for heterogeneous computing, including AI acceleration, networking, and cloud applications.
2. System Optimization & Productization: Design and optimize compute and networking acceleration architectures, including in-network computing, AI accelerators, and software-defined hardware solutions. Define memory hierarchy, cache coherence strategies, and interconnect topologies for efficient scaling.
3. Cross-Team Collaboration: Work closely with global R&D teams to align architectural roadmaps with industry trends in semiconductor, AI, and networking. Lead discussions with headquarters and external partners to advocate for architectural vision.
4. Industry Engagement & Thought Leadership: Publish research in top-tier conferences (e.g., ISCA, Hot Chips, DAC, NeurIPS) and contribute to patents and IP strategy. Collaborate with academia and industry groups to influence AI and semiconductor technology trends.

About the ideal candidate:

1. Ph.D. or Master’s in Computer Architecture, Electrical Engineering, or a related field.
2. 15+ years of experience in high-performance computing, xPU system design, or networking chip architecture.
3. Deep expertise in ISA design (Arm), vector processing, AI accelerators, and memory systems.
4. Proven experience in heterogeneous computing, HPC, and next-gen networking (RoCE, RDMA, InfiniBand, SmartNICs).
5. Strong background in software-hardware co-design, including firmware, compilers, and runtime optimizations.
6. Excellent communication skills, with experience engaging executives and global R&D teams.